The QUAD ASP-1H provides accurate and fast placement weather alone or in-line. For a precise and smooth operation the QUAD ASP-1H includes center-drive linear Servomotors. With QUAD ASP-1H using the QuadAlign System all components are optically aligns on the fly.

The QUAD ASP-1H is different to the ASP-1 in that it addresses the need of the hybrid market while also providing full SMT capabilities, The QUAD ASP-H1 also handles Wafer, Waffle and Tape presentation. Equipt with a large tabletop which accepts around 108 two-inch waffle packs or custom packs to decease setup and changeover time increasing productivity. the APS-1H can pick die "on-center" from oversized waffle pack cells. The APS-1H also has programmable placement force to protect fragile die by enabling you to set the amount of placement force and duration for each die type.

  • Direct Drive Theta: This feature provides the accuracy required in placing high lead QFP and BGA components
  • Non-Contact Linear Encoders: The APS-1 incorporates true linear positional feedback of the placement head for guaranteed long-term accuracy in the X- and Y-axes
  • QSoft-2: A unique system architecture that takes full advantage of Windows 98 and Intel Pentium processing to provide you with quick setup, easy programming, and fast placement sequence optimization
  • QuadAlign: This innovative optical centering technique precisely measures and aligns leaded and nonleaded surface mount components "on-the-fly
  • P4 Head Technology: This patented technology integrates two pickup nozzles with two independent Quad Align systems to process two components simultaneously and increases placement through put and provides in-process lead alignment of QFPs and BGAs
  • Programmable Transport: The APS-1 uses software-controlled motion to reduce board transport time. The unique multistage positioning system also minimizes the effect of board warpage, and improves board accuracy
  • Process Monitoring with Adaptive Control: The APS-1 with QuadAlign monitors components to correct pickup offsets automatically. They also monitor vacuum levels and other critical machine parameters, providing full reporting capabilities for automatic process stability